With the improvement of high-end, miniaturized digital merchandise such as cell phones, pocketbook computer systems, and PDAs, the demand for bendy boards is increasing, and hdi pcb manufacturers are accelerating the improvement of thinner, lighter and denser.
1.Single-layer FPC
It has a layer of chemically etched conductive patterns. The conductive sample layer on the floor of the bendy insulating substrate is a rolled copper foil. Single-layer FPC can be divided into the following 4 categories:
1-1.Single-sided connection besides cover
The wire sample is on an insulating substrate, and there is no protecting layer on the floor of the wire. The interconnection is realized by using soldering, fusion welding, or strain welding, which is often used in early telephones.
1-2.Single-sided connection with the cover
Compared with the preceding category, there is only one greater cowl layer on the floor of the wire. The pads want to be uncovered when covering, it is easy to no longer cover the stop area. It is one of the most extensively used single-sided bendy PCBs.
2.Double-sided FPC
Double-sided FPC has a layer of conductive patterns made on every facet of the insulating base film, which will increase the wiring density per unit area. The metallization holes join the two aspects of the insulating cloth to structure a conductive direction to meet the graph and use features of flexibility. T
he cowl movie protects single and double-sided wires and suggests the place the element is placed.
2-1.Double-sided connection besides cover
The land interface can be related to the front and returned of the wire. A by the gap is opened in the insulating substrate at the pad. This by means of the gap can be punched, etched, or different mechanical techniques at the favored role of the insulating substrate. to make.
2-2.Double-sided connection with an overlay
The former kind is one-of-a-kind in that there is a cowl layer on the surface, and the cowl layer has by using holes, permitting each facet to be terminated, and nevertheless keep the cowl layer, which is made of two layers of insulating cloth and a steel conductor.
3.Multi-layer FPC
Multi-layer FPC is a technique of laminating single or double-sided bendy circuits with three or extra layers, forming metalized holes by way of drilling collar L and electroplating, and forming conductive paths between one-of-a-kind layers. This eliminates the want for complex welding processes. Multi-layer circuits have large purposeful variations in phrases of greater reliability, higher thermal conductivity, and less complicated meeting performance.
The gain is that the substrate movie is light-weight and has notable electrical characteristics, such as a low dielectric constant. A multi-layer bendy PCB made of polyimide movie as a substrate is about 1/3 lighter than an inflexible epoxy glass pcb fabrication. Flexible, most of this merchandise does now not require flexibility. Multi-layer FPC can be similarly divided into the following types:
3-1.The finished bendy insulation substrate
This kind is manufactured on a bendy insulating substrate, and its completed product is precise to be flexible. This shape generally glues the two facet ends of many single-sided or double-sided microstrip bendy PCB China together, however, the central components are no longer bonded together, so it is surprisingly flexible. In order to have an excessive diploma of flexibility, a thin, appropriate coating, such as polyimide, can be used on the wiring layer rather than a thicker overlay.
3-2.Finished insulating base material
This kind is manufactured on a bendy insulating substrate, and the completed product is now not targeted to be flexible. This kind of multi-layer FPC is made of a bendy insulating material, such as a polyimide film, laminated into a multi-layer board, which loses its inherent flexibility after lamination.
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